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SpringSoft and TSMC Team for Multi-Node Process Design Kit Portfolio
Jun 25, 2009 (Close-Up Media via COMTEX) --
SpringSoft, a supplier of specialized IC design software, announced a multi-year technology agreement with TSMC to jointly develop and validate process design kits (PDKs) for chip manufacturing technologies.
The two companies said that the collaboration is driven by customer demand for SpringSoft PDKs and their mutual support of interoperable PDKs as the long-term goal for providing custom chip designers with the ultimate in manufacturing flexibility, technology choice, and design productivity.
Initial efforts are focused on development of TMSC-qualified PDKs to support the high performance and low power requirements of designers using SpringSoft's Laker custom IC design software at the 90-nanometer (nm), 65nm, and 45nm nodes. The first deliverable is the SpringSoft Laker 65nm CMOS PDK for digital, mixed-signal, and RF processes. The companies stated that this foundry-certified PDK enables Laker users to maximize productivity, reduce development cycles, and achieve first-pass silicon success. In addition, SpringSoft is working with TSMC to co-develop interoperable PDKs to provide even greater design flexibility, interoperability, and productivity.
"PDKs are an important part of the IC development ecosystem, particularly for custom chip designers that need the higher performance, power optimization, and scalability of leading-edge manufacturing technologies," said ST Juang, senior director of design infrastructure marketing at TSMC. "Our collaboration with SpringSoft reinforces our industry-leading drive toward interoperable PDKs as the preferred long-term solution. It also ensures that more designers can utilize the full range of our advanced processes today with access to fully-qualified Laker PDKs in order to meet their more immediate needs. "
"It takes more than advanced design automation to realize leading-edge chip designs. Designers need timely access to the latest, most accurate information for chip manufacturing technologies, so they can produce designs that offer less risk and yield predictable results," said Johnson Teng, chief operating officer of SpringSoft. "Interoperable PDKs and foundry-certified PDKs are both critical to the success of custom chip development. We are very pleased to be working with TSMC in support of our common goals, and are confident that the rapid completion of our first joint development milestone is the beginning of a successful, long-term relationship."
((Comments on this story may be sent to newsdesk@closeupmedia.com))
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